BesiEsec2100FCplus芯片焊接机
BesiSwitzerlandasarenownedleaderinprovidingdiebondersfortroublefreehighqualitymassproductionhasintegratedflipchipcapabilityintoits2100familyofdiebonders:BesiSwitzerland’sresponsetodrivingdownthecostofflipchiptechnology.
HighestUPHNoTimeWastedSimultaneousmovementofchipandcameranotimewastedforimagetakingLowvibrationsnotimewastedformotionsett领InnovativeparallelactivitymachinedesignwithPhi-Ymovementpick-and-placeFocusedonstripbasedproducts
Load&RunShortestTimetoYieldLoadrecipefromhostandrunonanymachineFullrecipetransferfrommachinetomachineOperatorindependentresultsensuredbyautocalibration
HighestUpTimeConsistentQualityReliableandaccurateflipchipprocessSmartandsafewafermapping
2100PlatformSynergiesReducedOperatingCostOnecompactflipmoduleisallthatmakesthedifferencetoepoxydiebondersofthe2100platformMostsparepartsarethesameleanstockandhighavailabilityFlexibleworkforcecross-trainedoperatorsandsupportteamsBondingmethodFlipChipBondingaccuracyDownto10μm(3σ)Min.cycletime400msWafersize4”to12”Framesize6",8”and12”Diesize0.5…20mm/20mils…0.8inchDiethickness≥0.1mm/≥4mils
(thinneronrequest)StripdimensionsLengthupto500mm
Widthupto125mm(flatboatsupto137mm)Machinedimensions1430x1440x1400mm(WxDxH)WeightApprox.1,400kg/3,000lbSubstrateHandlerActive-ZHandler137mmcold(STH137-AZ)StripHandler84mmFlipChipSoftwaretoRunSTH84-FCwithHigherSpeedAdvancedUPHDualInput(MHINandTOS)MagazineHandlerInput(MHINonly)RailDownholderMotorizedDownholderDisp/BondStripMarkingUnitSMEMALinkInputSMEMALinkOutput
SlideFluxerDuplexSlideFluxer
DispenserPDSEpoxyLevelDetectionPDSPurgeandPre-DispenseStationMultiDispenseProcess
DieEjectorDieEjectorwithMotorizedXandYAxisUltraThinDieNeedleModule
VisionDispenseVerticalIndirectIllumination(DVIILL)BondVerticalIndirectIllumination(BVIILL)DispenseQualityCheckBondQualityCheckPseudoX-ray
AutomationHostcommunicationinterfaceWafermappingincl.mapconversionE142stripmapping
MiscellaneousUninterruptiblePowerSupplytoPCIonizerPickIonizerBondIonizerControlledPick(IONC-P)IonizerControlledBond(IONC-B)IonizerControlledDispense(IONC-D)IonizerControlledWHLoadTop(IONC-WT)IonizerControlledWHLoadBottom(IONC-WB)IonizerControlledMagazineInput(IONC-MHIN)FineFilterUnitFineFilterUnitwithAirParticleSensorMiniSystemfortraining
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2004-11-07
