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Besi Esec 2100 hS 芯片焊接机

专业评测

BesiEsec2100hS芯片焊接机

TheDieBonderEsec2100hSisthe3rdgenerationofthemostflexible300mmhighspeedplatform,capableofrunninganextensiverangeofepoxydieattachapplicationssuchasQFN,TSOP,QFP,BGA,CSP-BGA,SiP-BGA,FBGAandLGA.Itisthemosteffortlesssystemtorun,assistandcontrolproductionresultinginaquantumleapinthroughputandyieldatthelowestcostofownership.Atitsintroduction,thisinnovativeplatformconceptwontheprestigiousSwissTechnologyAward.

KeyFeatures

LeadingEdgeMachineConceptRealtimeprocessmonitoringthrough4liveimagesofprocesszoneConstantstatuscontrolwithrealtimewafer,stripandmagazineviewerEfficientlearninganderrorrecoverythankstocontextsensitiveonlinehelp
HighestUpTimeRealtimeprocessmonitoringthrough4liveimagesofprocesszonesConstantstatuscontrolwithrealtimewafer,stripandmagazineviewerEfficientlearninganderrorrecoverythankstocontextsensitiveonlinehelp
HighestSpeedat20mAccuracyVeryshortpick&placecycletimeduetotherevolutionaryPhi-YconceptcombiningrotationalandlinearmovementsNew"light&rigid"pick&placestructure,advancedtrajectorycontrolaswellasaliquidcoo领systemensuringexcellentaccuracyathighestspeedPlacementaccuracydownto15m(3sigma)usingHighAccuracyMode
FastesttimetoYieldTool-lessexchangeofproductspecificpartsforfastestproductchangeoversTeachandsetupwizardsandparameterteachverificationeliminatesetuperrorsRecipetransferfrommachinetomachineenablesfastconversionHotandcoldprocessessupported:epoxy,soldering,thermo-compression,eutectic

ThePlatformoftheFutureNewcontrollerhardwareusingGigabitEthernetcommunicationenab领advancedprocessesNextgenerationplatformensuringupgradesandexpansionoffunctionalitiesatanytimeScalableperformance&applicationrange
BondingmethodEpoxyCycletime120mswithLiquidCoo领optionBondingaccuracy20m@3σ(15moption)Wafersize4"to12"(on8"or12"waferframes)Diesize0.25mm(withSmallDieKit)to20mmLeadframesizeLength:90to300mm
Width:23to100mmMachinedimensions1785x1448x1400mm(WxDxH)SubstrateHandlerDispenserPick&PlaceVisionAutomationMiscellaneous


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2004-11-07
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