BesiEsec2100SC芯片焊接机
TheDieBonderEsec2100SCisthemostflexible300mmhighspeedplatform,capableofrunningthesmartcardtape.Itisthemosteffortlesssystemtorun,assistandcontrolproductionresultinginaquantumleapinthroughputandyieldatthelowestcostofownership.Atitsintroduction,thisinnovativeplatformwasawardedwiththeprestigiousSwissTechnologyAward.
Keyfeatures
LeadingEdgeMachineConceptSingleclamptransportsystem1**%postbondQCinspectionathighspeedKeyalignmenttasksperformedbycamerasmakemanymechanicaladjustmentsobsoleteOptional3zoneheatingforpre-curing(accuracy)andvoidcontrol(dehumidification)
HighestUpTimeRealtimeprocessmonitoringthrough4liveimagesofprocesszonesConstantstatuscontrolwithrealtimewafer,tapeandmagazineviewerEfficientlearninganderrorrecoverythankstocontextsensitiveonlinehelp
HighestSpeedat25mAccuracyPhi-YPickandPlacewithsymmetricaldesignforshortsett领timeresultinginhighestUPHBestplacementaccuracythroughvibrationcontrolHigheststiffnessforhighestspeedANDaccuracy
FastestTimetoYieldTool-lessexchangeofproductandeasyloadingofmaterialforfastestproductchangeoversTeachandsetupwizardsandparameterteachverificationeliminatesetuperrorsRecipetransferfrommachinetomachineenablesfastconversion
ThePlatformoftheFuture3rdgenerationpickandplace50NbondforcestandardThirdprocessstationenableseasyadaptationtofutureleading-edgeapplications
BondingmethodEpoxyBondingaccuracyDownto25m@3σWafersize4"to12"(on8"or12"waferframes)Diesize0.5mmto20mmTapesizeWidth:35mmMachinedimensions3040x1448x1680mm(WxDxH)Section"TapeHandler"TapeHandler35mmhot(TPH35h)TapeInputHandler(TIH)TapeOutputHandler(TOH)TapeInputBuffer(TIB)TapeOutputHandlerSimplified(TOHS)TapeOutputHandlerDetached(TOHD)TapeOutputHandlerDetachedSimplified(TOHDS)
DispenserPDSEpoxyLevelDetectionPDSPurgeandPre-DispenseStation
Pick&PlaceMassflowDieSensorSmallDieKit
VisionIndirectIllumination(BVI/DVI)DispenseVerticalIndirectIllumination(DVIILL)DispenseQualityCheckBondQualityCheckBondVerticalIndirectIllumination(BVIILL)PickIndirectIllumination(PIILL)-CSRrequired
CuringCompactCuringCompactCuring,integratedExhaustCuringOvenCuringOvenwithRail
AutomationWaferMappingincludingConversionHostCommunicationInterface
Miscellaneous
仪器网-专业分析仪器服务平台,实验室仪器设备交易网,仪器行业专业网络宣传媒体。
相关热词:
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2004-11-07