BesiEsec2100xPplus芯片焊接机
TheDieBonderEsec2100xPplusisthethe2ndgenerationofthemostflexible300mmhighspeedplatform,capableofrunningthefullrangeofepoxydieattachapplicationssuchasQFN,TSOP,QFP,BGA,CSP-BGA,SiP-BGA,FBGAandLGA.Itisthemosteffortlesssystemtorun,assistandcontrolproductionresultinginaquantumleapinthroughputandyieldatthelowestcostofownership.Atitsintroduction,thisinnovativeplatformwasawardedwiththeprestigiousSwissTechnologyAward.
KeyFeatures
LeadingEdgeMachineConcept3fullydecoupledprocessstationsallowtohandleanysubstrateupto300mmlengthwithoutanyrestrictionsReloadingofmaterialfromthefrontwhilemachineisinfulloperationKeyalignmenttasksperformedbycamerasmakemanymechanicaladjustmentsobsolete
HighestUpTimeRealtimeprocessmonitoringthrough4liveimagesofprocesszonesConstantstatuscontrolwithrealtimewafer,stripandmagazineviewerEfficientlearninganderrorrecoverythankstocontextsensitiveonlinehelp
HighestSpeedat15mAccuracy167mspick&placecycletimeduetotherevolutionaryPhi-YmechanismcombiningrotationalwithlinearmovementsPlacementaccuracyof15m(3sigma)throughvibrationcontrolandHighAccuracyModeHigheststiffnessforhighestspeedANDaccuracy
FastestTimetoYieldTool-lessexchangeofproductspecificpartsforfastestproductchangeoversTeachandsetupwizardsandparameterteachverificationeliminatesetuperrorsRecipetransferfrommachinetomachineenablesfastconversion
ThePlatformoftheFutureHandlesallhigh-endepoxyprocessesonstripforsubstratelengthsupto300mm50NbondforcestandardThirdprocessstationenableseasyadaptationtofutureleading-edgeapplicationsBondingMethodEpoxyCycletime167msBondingaccuracyDownto15m@3σWafersize4"to12"(on8"or12"waferframes)Diesize0.25mm(withSmallDieKit)to20mmLeadframesizeLength:90mmto300mm
Width:9mmto84mmMachinedimensions1,785x1,448x1,400mm(WxDxH)SubstrateHandlerDualInput(MHINandTOS)MagazineHandlerInput(MHINonly)RailDownholderMotorizedDownholderDisp/BondStripMarkingUnitStriphandler84mmcoldtapedQFNStriphandler84mmhot1zoneStriphandler84mmhot1zoneflexibleStriphandler100mmhot1zoneflexibleSMEMALinkInputSMEMALinkOutput
DispenserPDSEpoxyLevelDetectionPDSPurgeandPre-DispenseStationMultiDispenseProcess
Pick&PlaceMassflowDieSensorSmallDieKitHighAccuracyMode
VisionIndirectIllumination(BVI/DVI)DispenseVerticalIndirectIllumination(DVIILL)DispenseQualityCheckBondQualityCheckBondVerticalIndirectIllumination(BVIILL)AutomationWaferMappingincludingConversionHostCommunicationInterfaceE142StripMapping(CSRrequired)
MiscellaneousUninteruptiblePowerSupplytoPCIonizerPickIonizerBondIonizerControlledPick(IONC-P)IonizerControlledBond(IONC-B)IonizerControlledDispense(IONC-D)IonizerControlledWHLoadTop(IONC-WT)IonizerControlledWHLoadBottom(IONC-WB)IonizerControlledMagazineInput(IONC-MHIN)FineFilterUnitFineFilterUnitwithAirParticleSensor
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2004-11-07
