BesiEsec2100sDplus芯片焊接机
TheEsec2100sDplus,the2ndgenerationoftheprovenDieBondingFamily,offersawiderangeofbenefitswiththesoletargetofproducinghighestqualityatlowestcostperdieplacement.Specialhand领andoperatingaspectsofstackeddieareincorporatedintherevolutionarymachineconcept.FurtherredefiningStackedDieBonding.Foryourbenefit.
KeyFeatures
12mAccuracy@3Sigma(filmbasedapplicationsinHighAccuracyMode)RevolutionaryPhi-YpickandplaceStablehighaccuracythankstovibrationcontrol
WidestApplicationRangeFromepoxytomostadvancedstackeddieapplications(amongstothersBGA,CSP-BGA,SiP-BGA,FBGA)Patentedultrathindiepickupsolutions50NbondforcestandardUpto125mmsubstratewidth
ShortestTimetoYieldRecipetransferfrommachinetomachineOperatorindependentresultsduetoautocalibrationconceptTool-lessexchangeofexpansionunitinlessthan30seconds
HighestUpTime4livecamerapicturesondisplayatalltimeStripandmagazineviewersOnlinehelpEasymaintainability
PlatformoftheFutureThirdprocessstationforadditionalprocessexpansionsExpandableforthefuturethankstorevolutionarymachineconceptBondingmethodEpoxyandDAFCycletime265msBondingaccuracyDownto12m@3σWafersize4"to12"(on8"or12"waferframes)Diesize0.25mm(withSmallDieKit)to20mmStripdimensionsLength:90mmto300mm
Width:20mmto125mmMachinedimensions1785x1448x1400mm(WxDxH)SubstrateHandlerDualInput(MHINandTOS)MagazineHandlerInput(MHINonly)RaildownholderMotorizedDownholderDisp/BondStripMarkingUnitStriphandler125mmhottapedQFNStriphandler137mmhotStageZSMEMALinkInputSMEMALinkOutput
DispenserPDSEpoxyLevelDetectionPDSPurgeandPre-DispenseStationMultiDispenseProcess
Pick&PlaceFusionBondProcessMassflowDieSensorSmallDieKitParallelPick&PlaceHighAccuracyMode
DieEjectorUltraThinDieNeedleModuleUltraThinDiePeel(CSRrequired)UltraThinDieMultidisc(CSRrequired)
VisionIndirectIllumination(BVI/DVI)DispenseVerticalIndirectIllumination(DVIILL)DispenseQualityCheckBondQualityCheckBondVerticalIndirectIllumination(BVIILL)AutomationWaferMappinginclusiveConversionHostCommunicationInterfaceE142StripMapping(CSRrequired)
MiscellaneousUninterruptiblePowerSupplytoPCIonizerPickIonizerBondIonizerControlledPick(IONC-P)IonizerControlledBond(IONC-B)IonizerControlledDispense(IONC-D)IonizerControlledWHLoadTop(IONC-WT)IonizerControlledWHLoadBottom(IONC-WB)IonizerControlledMagazineInput(IONC-MHIN)FineFilterUnitFineFilterUnitwithAirParticleSensor
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2004-11-07
