BesiEsec2100sDadvanced芯片焊接机
ThelatestmemberofthefieldprovenHigh-endEsec2100sDmachinefamilyisfeaturingthenew3rdGenerationHighResolutionVisionSystem,acompletelyredesignedcleanunitaswellasneweasytouseGUI.ThenewEsec2100sDadvancedDieBonderisabletohandlethemostchallengingthindieandwarpedstrippackages.Theproven“light&rigid”structureofthePick&Placeensureshighestaccuracyandmaximizedthroughput.ThisfinepieceofEsecHigh-endEquipmentquaranteesmaximumflexibilityandoutstandingprocesscapabilitiesmeetingtoday’sandtomorrow’srequirements.
NextGenerationTwoinOneDieBonder
Twoinonemachineconfiguration.SinglePick&PlaceandadditionalparallelPick&PlaceInstantswitchingbetweensingleandparallelPick&PlacemodeNewtransfertableaxisinparallelmodulewithsignificanthigheraxisperformanceExcellentstandarddieproductivitySuperiorultrathindieproductivitySpeed&AccuracyNewGenerationCleanKit3rdGenerationVisionSystemEaseofUseSuperior“light&rigid”P&PdesignVoicecoildriveXaxisEnhancedZaxiswithintegratedencoderHighperformanceYaxiswithoptionalLiquidCoo领SystemAdvancedRealtimeTrajectoryControllerHighAccuracyModeHighFlowBondHead
AirflowfromfronttobackProgrammableairflowfrom3to12qmStandbymodeifnostriploadedULPAfilteravailableISOclass4(withcleanspeed)Additionalanticontamination,removedustandparticleskitavailable
Highresolution4megapixelcamerasSharpimagewith12.4μm/pixelresolutionDualcolorilluminationfeaturingredandwhitelightThreelightsourcespercamera(direct,indirectandvertical)Highresolutionenab领crackeddieanddefectsdetection
New16:9GUITwoinspectionimagedisplaymodeDisplayofinspectionimageandstatisticorinspectionimageandwafermapatthesametime
Graphicalstatusoverviewofvacuum,airpressuretempertureforallpurposes
DiePlacementAccuracy&ProductivityDAF,inStandardMode:15μm/0.15°@3σ*/drycycle232msDAF,inHighAccuracyMode:10μm/0.15°@3σ*/drycycle256msDAF,inParallelMode:8μm/0.12°@3σ**/drycycle396ms
*withdiesize>2x2mm**withdiesize>3x3mm
ProcessBondForce:0.2-50NBondRotation:360°ProgrammablePre-bond/bond/post-bondheating:programmable,max.200°C
SubstratesLength:120mm-300mmWidth:15-125mmThickness:0.1-2.5mm
WaferandDieDimensionsWaferSize:Upto12”DieSize:0.5x0.5mm-20x20mm/20x20mils-800x800milsMachineDimensionsFootprintWxDxH:1785x1448x1400mm
Weight:1600kg/3500lb
SubstrateHandlerDualInput(MHINandTOS)MagazineHandlerInput(MHINonly)RaildownholderMotorizedDownholderDisp/BondStripMarkingUnitStripThicknessCompensationStripHandler125mmhotFlatwithmagneticY-Push-InStripHandler125mmhottapedQFNStripHandler125mmhotStage-ZSubstrateBlow-OffKitRoll-OutSlippageCheckControlledY-AxisRoll-OutSMEMALinkInputSMEMALinkOutputPickStripfromBox
DispenserPDSEpoxyLevelDetectionPDSPurgeandPre-DispenseStation
Pick&PlaceFusionBondProcessMassflowDieSensorSmallDieKitParallelPick&PlaceUnitUplookingSetupCameraLiquidCoo领System
DieEjectorUltraThinDieNeedleModuleUltraThinDieMultidiscModule
VisionDispenseIndirectIllumination2colorsBondIndirectIllumination2colorsDispenseVerticalIndirectIlluminationBondVerticalIndirectIlluminationDispenseQualityCheckBondQualityCheck
AutomationWaferMappinginclusiveConversionHostCommunicationInterfaceE142StripMapping
MiscellaneousUninterruptiblePowerSupplytoPCIonizer-ControlledPickIonizer-ControlledBondIonizer-ControlledDispenseIonizer-ControlledWHLoadTopIonizer-ControlledWHLoadBottomIonizer-ControlledMagazineInputIonizer-ControlledTransferTableCleanMachineEnvironmentKitAirParticleSensorStripCleaningUnitParticleRemovalKit
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2004-11-07
