法国SET ACCμRA M 键合机

‍SET ACCμRA M 键合机

       法国SET的键合压力控制在不同的范围内采用了不同的高精度压力传感器，确保了在不同的压力范围内，都能够得到zui佳的压力控制精度。

Applications

• Laser diode, laser bar • VCSEL, photo diode

• LED

• Prisms, lenses, mirrors • Micro assembly

• Flip-chip bonding, die bonding

• Chip-to-chip, chip-to-substrate bonding

Specifications

• Accuracy* ±1 μm

•Post-bond accuracy: +/- 5 μm

•Range of force

Low force arm: 20 g to 1 kg

High force arm: 100 g to 20 kg

•Temperature up to 400°C Independent heating for chip and substrate

•High resolution vertical movement 74 mm, resolution 0.01 μm Driven by linear motor