深圳市蓝星宇电子科技有限公司
深圳市蓝星宇电子科技有限公司

美Sonix 超声波扫描显微镜 ECHO-VS

ECHO-VS 超声波扫描显微镜

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SONIX ECHO VS™ 是专为更高精度要求,更复杂元器件设计的新一代设备。广泛应用在 Flip chips,Stacked die,Bumped die,Bonded wafers 等。

● 高分辨率下,扫描速度是传统超声波扫描显微镜的2.5倍
● 独有的波形模拟器(Waveform Simulator)及波束仿真(Beam Emulator)
● 扫描分辨率小于1微米
● 水温控制系统及紫外杀菌系统超高频状态工作下,信号更稳定

 

 

Sonix 非破坏超声波扫描是一款提高生产、简化测试、改进生产率和提高产能的生产和实验室设备。无论是失效分析实验室的详细分析还是生产线检测,Sonix 都能提供一个易于操作的软件解决方案。

﹡WinIC Lab (详细失效分析工具)

﹡WinIC Production (易于操作的、新型的生产工具,专门用于生产的大量分析)

 

ECHO-VS Ultrasonic Scanning Microscope

 

Sonix Echo VS™ is a next-generation device designed for higher precision and more complex components.It is widely used in Flip chips, Stacked die, Bumped die, Bonded wafers, etc.

 

● At high resolution, scanning speed is 2.5 times that of traditional ultrasonic scanning microscope

● Unique Waveform Simulator and Beam Emulator

● Scan resolution less than 1 micron

● Water temperature control system and UV sterilization system work in UHF state, the signal is more stable

 

SONIX Nondestructive Ultrasonic Scanning is a production and laboratory device that enhances production, simplifies testing, improves productivity and increases productivity.Whether it's detailed analysis in the failure analysis lab or inspection on the production line, Sonix provides an easy-to-use software solution.

 

* WinIC Lab (detailed failure analysis tool)

 

* WinIC Production (easy-to-use, new Production tools, designed for Production of large volumes of analysis)


美Sonix 超声波扫描显微镜 ECHO-VS,是专为更高精度要求,更复杂元器件设计的新一代设备, 扫描分辨率小于1微米
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