Mini MASTER Overview
Mini MASTER workstations are tailored for specific applications. Intended primarily for Research and Development laboratories, Mini MASTERs offer excellent payback while keeping high performance.
Specification
Description
Specifications
Options
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Mini MASTER's are high payback laser micro machining workstations tailored for specific applications in Research and Development laboratories or small batch production.
Being smaller brothers of MASTER workstations, Mini MASTERs perform marking, cutting drilling, surface structuring and fit into reduced foot print.
Ultra short pulse lasers and SCA laser micro machining software complies to high requirements in solar cells applications, extra hard materials processing (like tungsten carbide), etc.
Description
| Speed and spatial precision | Precision of laser micro machining is achieved by ultra-short laser pulses, state of the art Galvo Scanners and optics. In Mini MASTER workstations nano or pico second laser pulses cause minimal heat-affected zone and maximize spatial precision. High pulse repetition rate and adequate pulse energy ensure fast material removal during ablation or marking. Options of three different working wavelengths offer many machining possibilities for wide range of materials. | ||
Accuracy of positioning | Maximum firing accuracy and spatial resolution are achieved due to advanced beam delivery scheme. Fast galvoscanner for high throughput. | ||
| Safety and robustness | Class 1 laser-safe and clean-room compatible enclosure ensures robustness and reliability. | ||
| Advanced control | Designed specifically for laser micro machining, SCA software provides automatic control of Mini MASTER workstation, easy design or import of patterns, flexible modification and simulation of micro machining process | ||
| Applications | Ablation |
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| Cutting and drilling |
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| Marking |
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| Surface Structuring |
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Specifications
Galvo scanner
| Scanning field | 100 x 100 mm |
| Focal lenght of f-Theta lens | 160 mm |
| Marking speed | 3,5 m/s |
| Positioning speed | 15,0 m/s |
| Laser and motion synchronization | Laser pulse synchronized output |
Optics
| Spot size (optics and wavelength dependent) | down to 3 μm |
| Output beam | single- or multi-wavelength |
| System control | Industrial type control computer LCD display and keyboard SCA software running on MS Windows OS |
| Laser and motion synchronization | Laser pulse synchronized output |
Physical Characteristics
| Dimensions (approx.), W×D×H | 1110×760×1440 mm |
| Power requirements, maximum | 2000 W |
(* Dimensions can be adjusted during design of ordered workstation)
Options
Laser options
| Laser | Wawelenght and Power | Pulse energy | Pulse duration | Repetition rate | Beam quality |
| Nanosecond laser | 20 W @ 1064 nm 8 W @ 532 nm | 0.2 mJ @ 1064 nm | < 30 ns | 5 - 100 kHz | M2 < 1.3 |
| Picosecond laser | > 16 W @ 1064 nm > 8 W @ 532 nm > 4 W @ 355 nm | > 160 μJ @ 1064 nm | < 10 ps | Single shot to 500 kHz | M2 < 1.5 |
Customization options
Tables for samples with motorized or manual Z and tilt axis adjustment
Automatic harmonics switching
Automatic focus adjustment
Automatic scanner self - calibration
Vacuum chucks for sample holding
Dust and fume extraction system
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