高分辨非制冷热红外相机
高分辨非制冷红外相机具有优越的成像质量，高温度分辨率（0.05oC）以及准确的温度分析功能。这款高性能的热成像相机带有Cameralink或Gige接口。
该热成像相机全帧频50Hz（640×480），与工业标准Cameralink相配合，适合高速成像。并且，开窗模式下帧频更高。
应用： 优势:
半导体检测 高灵敏度
NDT：热像图 高分辨率
农作物分析 结构紧凑
精确温度测量 接口兼容
质量控制 全帧频高
实时过程控制
热成像相机指标参数：
Array type | Uncooled microbolometer (a-Si) |
# pixels | 640 (W) x 480 (H) |
Pixel pitch | 17 μm |
Spectral band | 8 μm to 14 μm |
NETD | 55 mK @ 30°C with F/1 lens |
Array cooling | Uncooled |
Pixel operability | > 99.5%* |
Lens | |
Focal length | Various lenses available |
Optical interface | Lens mount supporting multiple lenses |
Imaging performance | |
Frame rate (full frame) | 50 Hz |
Window of interest | Minimum size 160 x 120 (shuttered) |
Temperature stabilization | No ThermoElectric Cooling required (TEC-less) |
Integration type | Rolling shutter |
On-board image processing | NUC (Non-Uniformity Correction) Auto-offset and auto-gain with selectable region of interest XIE (Image Enhancement) Histogram equalization |
On-board functionality | Self-starting, trigger possibilities, BIST (Build-In Self-Test), lifetime and power-on counter, test-pattern |
A to D conversion resolution | 16 bit |
Interfaces | |
Camera control | CameraLink: XSP |
Image acquisition | CameraLink |
Trigger | In or out (configurable) |
Power requirements | |
Power consumption | < 2 W |
Power supply | 12 V DC |
Physical characteristics | |
Shock | 40 g, 11 ms according to MIL-STD810G |
Vibration | 5 g (20 Hz to 2000 Hz) according to MIL-STD883J |
Ambient operating temperature | - 40 °C to 60 °C (industrial components) |
Storage temperature | - 45 °C to 85 °C (industrial components) |
Dimensions | 49 W x 49 H x 61.35 L mm³ (lens not included) |
Weight camera head | 208 g (lens not included) |
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