RSAM共振可饱和吸收镜-上海屹持光电技术有限公司

详细信息

产品简介

共振可饱和吸收镜RSAM类似于可饱和吸收镜SAM，但是有更大的饱和吸收率、更小的带宽以及更低的饱和通量。共振可饱和吸收镜被设计成Gires–Tournois干涉仪的结构，一块可饱和吸收体放置在共振腔内光学波腹处的位置，下图原理简介：

规格参数

RSAM™ - resonant saturable absorber mirror 980 nm

Part No.	Description	Data PDF
RSAM-980-1ps-x	RSAM: λ = 980 nm, modulation depth ΔR = 60 %, low intensity reflectance < 1%, low intensity absorption > 99 %, FWHM = 16 nm, relaxation time t ~ 1 ps
RSAM-974-1ps-x	RSAM: λ = 974 nm, modulation depth ΔR = 60 %, low intensity reflectance < 1%, low intensity absorption > 99 %, FWHM = 16 nm, relaxation time t ~ 1 ps

RSAM™ - resonant saturable absorber mirror 1030 nm

Part No.	Description	Data PDF
RSAM-1030-9ps-x	RSAM: λ = 1030 nm, modulation depth ΔR = 60 %, low intensity reflectance < 1%, low intensity absorption > 99 %, FWHM = 25 nm, relaxation time t ~ 9 ps

RSAM™ - resonant saturable absorber mirror 1064 nm

Part No.	Description	Data PDF
RSAM-1064-x	RSAM: λ = 1064 nm, modulation depth ΔR = 60 %, low intensity reflectance < 1%, low intensity absorption > 99 %, FWHM = 25 nm, relaxation time t ~ 9 ps
RSAM-1060-x	RSAM: λ = 1060 nm, modulation depth ΔR = 55 %, low intensity reflectance < 1%, low intensity absorption > 99 %, FWHM = 40 nm, relaxation time t ~ 3 ps

RSAM™ - resonant saturable absorber mirror 1550 nm

Part No.	Description	Data PDF
RSAM-1550-10ps-4.0-x	RSAM: resonant saturable absorber mirror, λ = 1530 ... 1560 nm, resonant absorptance > 96 %, low intensity reflectance @ 1550 nm < 4 %, relaxation time ~ 10 ps

封装规格描述

Part No. example	Description		Data PDF
RSAM-980-1ps-x	Resonant Saturable Absorber Mirror
RSAM-980-1ps-x	working wavelength 980 nm
RSAM-980-1ps-x	relaxation time 1 ps
	unmounted RSAM, thickness: 450 µm
RSAM-980-1ps-4.0-0	chip area: 4.0 mm x 4.0 mm, unmounted
RSAM-980-1ps-1.0b-0	chip area: 1.0 mm x 1.0 mm, batch of 4 unmounted chips
RSAM-980-1ps-1.3b-0	chip area: 1.3 mm x 1.3 mm, batch of 4 unmounted chips
FM-1.3	Fiber Mount for 1.3 mm x 1.3 mm chips
	mounted RSAM , chip area 4mm x 4mm
RSAM-980-1ps-4.0-12.7 g	glued on a copper heat sink with 12.7 mm diameter
RSAM-980-1ps-4.025.0 g	glued on a copper heat sink with 25.0 mm diameter
RSAM-980-1ps-4.0-25.4 g	glued on a copper heat sink with 25.4 mm diameter
RSAM-980-1ps-4.0-12.7 s	soldered on a copper heat sink with 12.7 mm diameter
RSAM-980-1ps-4.0-25.0 s	soldered on a copper heat sink with 25.0 mm diameter
RSAM-980-1ps-4.0-25.4 s	soldered on a copper heat sink with 25.4 mm diameter
RSAM-980-1ps-4.0-25.0 h	thin film soldered 4.0 mm x 4.0 mm chip on water cooled copper heat sink with25.0 mm diameter for high power applications
	mounting position of the RSAM chip	center mounted edge mounted
RSAM-980-1ps-4.0-12.7g-c	center position
RSAM-980-1ps-4.0-12.7g-e	edge position
	fiber mounted RSAMs-x
RSAM-980-1ps-FC/PC	mounted on a 1 m long single mode fiber with FC/PC or other connector type
RSAM-980-1ps-FC/PC with TEC	mounted on a 1 m long single mode fiber with FC/PC or other connector type and TEC (thermoelectric cooler) for fine tuning of the resonance wavelength