法国SET键合机/芯片与芯片键合机/法国set 芯片与晶元键合机

ACCμRA M 

法国SET的键合压力控制在不同的范围内采用了不同的高精度压力传感器，确保了在不同的压力范围内，都能够得到ZJ的压力控制精度。

Applications

• Laser diode, laser bar • VCSEL, photo diode

• LED

• Prisms, lenses, mirrors • Micro assembly 

• Flip-chip bonding, die bonding

• Chip-to-chip, chip-to-substrate bonding

Specifications

• Accuracy* ±1 μm

•Post-bond accuracy: +/- 5 μm 

•Range of force

Low force arm: 20 g to 1 kg

High force arm: 100 g to 20 kg 

•Temperature up to 400°C 

Independent heating for chip and substrate

•High resolution vertical movement 

 74 mm, resolution 0.01 μm Driven by linear motor