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美国MTI 测量硅片几何参数(TTV/BOW/WARP/FLATNESS)

赛伦科技（北京）有限责任公司

企业性质生产商

入驻年限第10年

营业执照已审核
同类产品工艺设备(9件)

公司简介：

美国MTI公司为半导体行业硅片几何参数测量技术-电容探头领域的佼佼者，与昔日的ADE齐名：为世界半导体业硅片几何参数测量的标准测试设备；为纳斯达克上市企业。

仪器简介：

  主要参数：

1. Diameter: 150mm,200mm,300mm

2. Material: All semiconducting,and semi-insulating matrrials

3.Surfaces: As-Cut, Lapped, Etched,Polished,Patterned; Bare wafer/Quartz Base,Tape

4.Thickness: (ASTM F533),Range-+/-500um;Accracy-+/-0.25um; Repeatability-0.050um

5.TTV: (ASTM F533) Range-+/-500um; Accuracy-+/-0.050um; Repeatablity-0.050um

6.Bow:(ASTM F1390) Range-+/-250um; Accuracy-+/-2.0um; Repeatabiligy-0.75um

7.Flatness(Global)(ASTM F1530) Rang:8mm; Accuracy-+/-0.05um; Repeatbility-0.030um

8.Flatness(Site)(ASTM F1530) Rang:8mm; Accuracy: +/-0.05um; Repeatbiligy:0.030um


设备：
Proforma 300SA：半自动ZUI大12寸晶圆几何参数测量仪；

Proforma 200SA：半自动型ZUI大8寸晶圆几何参数测试仪；

测试数据/结果例子：




























23-Sep-2013






Wafer Summary Report



Page:1.00






































Operator:
Administrator



Lot Number:DK Wafer 200mm


Passed:4











Measurement Date:09/23/2013



Recipe:200mm,33,m,1notch,1-29-13 1 run

Failed:0











Measurement Time:17:51:58









Yield:100.0%
































































WaferWaferCenterAvgMinMax
3PTLSQ3PTLSQ






MaxMaxMaxMaxMaxMaxMaxMax% Sites
NumberIDThicknessThicknessThicknessThicknessTTVBowBowWarpWarpSoriGBIRGF3RGFLRGBIDGF3DGFLDSBIRSF3RSFLRSFQRSBIDSF3DSFLDSFQDPassed


(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)(uM)

Low Limit

























High Limit
























1.00shiny side729.56729.15728.83729.650.82-0.20-2.2118.3217.7417.720.820.760.750.820.630.480.290.300.300.130.210.200.200.07100.00
2.00dull side729.60729.14728.77729.730.963.855.5917.3417.3217.560.960.770.770.960.640.540.320.340.340.190.260.250.250.13100.00
3.00shiny side729.52729.10728.77729.610.840.33-1.5516.7517.3017.270.840.750.740.840.610.480.340.330.330.130.190.190.190.09100.00
4.00dull side729.54729.10728.76729.680.923.295.3417.2117.2917.530.920.790.760.920.610.530.290.270.280.180.270.260.260.10100.00




























Minimum729.52729.10728.76729.610.82-0.20-2.2116.7517.2917.270.820.750.740.820.610.480.290.270.280.130.190.190.190.07100.00

Maximum729.60729.15728.83729.730.963.855.5918.3217.7417.720.960.790.770.960.640.540.340.340.340.190.270.260.260.13100.00

Average729.56729.12728.78729.670.891.821.7917.4117.4117.520.890.770.760.890.620.510.310.310.310.160.230.230.230.10100.00

Std Dev0.0300.0220.0280.0440.0561.7723.6810.5730.1900.1620.0560.0150.0120.0560.0140.0250.0220.0290.0250.0250.0320.0290.0300.0210.000



























200SA/300SA操作界面，3D图形貌显示

技术参数：

1. Diameter: 150mm,200mm,300mm

2. Material: All semiconducting,and semi-insulating matrrials

3.Surfaces: As-Cut, Lapped, Etched,Polished,Patterned; Bare wafer/Quartz Base,Tape

4.Thickness: (ASTM F533),Range-+/-500um;Accracy-+/-0.25um; Repeatability-0.050um

5.TTV: (ASTM F533) Range-+/-500um; Accuracy-+/-0.050um; Repeatablity-0.050um

6.Bow:(ASTM F1390) Range-+/-250um; Accuracy-+/-2.0um; Repeatabiligy-0.75um

7.Flatness(Global)(ASTM F1530) Rang:8mm; Accuracy-+/-0.05um; Repeatbility-0.030um

8.Flatness(Site)(ASTM F1530) Rang:8mm; Accuracy: +/-0.05um; Repeatbiligy:0.030um

主要特点：

1. Diameter: 150mm,200mm,300mm

2. Material: All semiconducting,and semi-insulating matrrials

3.Surfaces: As-Cut, Lapped, Etched,Polished,Patterned; Bare wafer/Quartz Base,Tape

4.Thickness: (ASTM F533),Range-+/-500um;Accracy-+/-0.25um; Repeatability-0.050um

5.TTV: (ASTM F533) Range-+/-500um; Accuracy-+/-0.050um; Repeatablity-0.050um

6.Bow:(ASTM F1390) Range-+/-250um; Accuracy-+/-2.0um; Repeatabiligy-0.75um

7.Flatness(Global)(ASTM F1530) Rang:8mm; Accuracy-+/-0.05um; Repeatbility-0.030um

8.Flatness(Site)(ASTM F1530) Rang:8mm; Accuracy: +/-0.05um; Repeatbiligy:0.030um