直插式样品托 DIP

DIP Specifications(Avail. Upon Request)

The standard Sidebraze package, commonly known as a "DIP", consists of two rows of leads brazed onto the sides of the ceramic. The row spacing varies from leadcount, but can come in .300, .400, .600 and .900 inch wide configurations.

The DIP is extremely popular due to its reliability and ease of use. As the lead count increases, the package size increases sharply thereby reducing the space efficiency. As the lead count increases, the internal lead traces also increase. This will increase the electrical characteristics of the package (i.e. inductance, resistance and impedance).

Advantages of DIP:

High performance and realibility

Ease of PC board mounting via socket, manual or automated equipment

Ease of soldering and reliable removal techniques

Lead spacing matches common PC Board layouts and allow one or more leads to run between the PC Board holes

Effective heat dissipation

Hermetically seal using solder, glass or epoxy