电子元器件的切割和镶嵌-失效分析

Microelectronics, Part I: Cutting, Mounting Written by:
Scott Holt,Applications Engineer,Buehler
Editor:George Vander VoortDirector, Research and Technology,
Buehler Introduction For most microelectronic devices and packages,
direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructive
inspection are employed.
In order to produce a cross section, many of
the techniques used in the metals industry
have been borrowed; to a large degree, with
success. However, the philosophy and logic
for choosing a particular method of cutting,
mounting, and abrasive preparation has often
been lost in the process. This is of
extreme significance because the needs of
the microelectronics industry vary greatly
from those of the metals industry. Issues such
as feature size, specific area cross sectioning,
and the ability to prepare a variety of
materials with different mechanical properties
within a single plane of polish require
an understanding of basic abrasive processes
so that appropriate sectioning
methods might be developed.
This issue of TECH-NOTES is the first half of
a two part effort to summarize some of the
basic concepts involved in proper preparation
of microelectronic materials. We will
discuss some simple guidelines which the
microelectronic materials analyst might draw
upon in the development of better preparation
techniques. In particular, this issue will
cover the variables involved in cutting and
mounting of microelectronic materials, and
summarize some of the technique and consumable
choices that must be considered
in order to achieve quality results. The next
microelectronics issue of TECH-NOTES will
continue with the abrasive processes of
grinding and polishing these materials. SEM&TEM 样品磨制系统